Clustered configuration with load-lock and process chambers. Automated programmable operation.
Chambers available:
- Chamber 1: PECVD (SiH4, NH3, O2, Ar, N2)
- Chamber 5: ICP-RIE (CF4, CHF3, O2, Ar, N2)
Main specifications:
- Load-lock capacity 25 wafers
- Wafer size: up to 6 inch
Funding and acknowledgements:
- PECVD retrofit (2019) and RIE chamber (2020) funded by GVA/IDIFEDER2018/042 project
- RIE ICP source and cluster automation (2020) funded by AEI EQC2019-006407-P
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