Manual mask aligner with top-side and bottom-side alignment. The EVG620 NT is equipped with integrated vibration isolation and achieve excellent exposure results for a wide range of applications, such as exposure of thin and thick resists, patterning of deep cavities and comparable topographies, as well as processing thin and fragile materials such as compound semiconductors.
Main specifications:
- Substrate / Wafer dimensions up to 150 mm
- LED i-Line exposure
- Sector exposure
- Up to 180 WPH in first print mode / up to 140 WPH in automatic alignment mode
- Top side alignment ≤ ± 0.5 µm; Backside/IR alignment ≤ ± 1 µm; Dynamic alignment ≤ ± 0.3 µm
- Microscope with auto-refocus function
- Adjustable illumination spectrum to optimize contrast
Funding and acknowledgements:
- Fully acquired through GVA/IDIFEDER2018/042 project
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