The H-system is a versatile pick-and-place system in overhead gantry arrangement with integrated beam splitter optics.

Features:

• Overhead gantry arrangement
• Beam splitter optics
• Fully programmable bond process
• Height adjustable bond stage
• Bond force: 10-500cN
• Positioning accuracy: 5 micron
• Maximum component size 25mm x 25mm
• Maximum substrate size 300mm x 300mm
• Working area: 300mm x 240mm
• Foot print: 600mm x 580mm x 420mm