The HB05 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding mode. Only a tool change is necessary. Easy operation with a TFT display, direct access and simple adjustment of all bond parameters.

Features:

• Motorized Tail Control
• 4" TFT Display for Easy Control of all Bond Parameters
• Simple Change between Ball Bonding and Wedge Bonding
• Deep Access Bondhead
• Electronic Wire Clamp for Precise Tail Length Control
• Easy Setting Recall when Working on Different Applications