The E460 is designed for polishing and planarization of single wafers with diameters between 2" and 8".
Characteristics of the E460 G CMP tools:
- 10, 18, or 24 polishing steps
- Control of 2 to 4 slury pumps during polishing and conditioning
- « ex-situ » or « in situ » conditioning
- stand by mode
- possibility of reinforced wafer rinsing
- rinsing of the conditioning tool when in the inactive position
- touch screen for machine control
- secured access for the operators
- plate centrifugation before process start
- integrated end point software (option)
