Picture of Chemical Mechanical Polisher
Current status:
AVAILABLE
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The E460 is designed for polishing and planarization of single wafers with diameters between 2" and 8". 

Characteristics of the E460 G CMP tools:

  • 10, 18, or 24 polishing steps
  • Control of 2 to 4 slury pumps during polishing and conditioning
  • « ex-situ » or « in situ » conditioning
  • stand by mode
  • possibility of reinforced wafer rinsing
  • rinsing of the conditioning tool when in the inactive position
  • touch screen for machine control
  • secured access for the operators
  • plate centrifugation before process start
  • integrated end point software (option)

Tool name:
Chemical Mechanical Polisher
Area/room:
White room
Category:
Other processes
Manufacturer:
TBD
Model:
TBD

Instructors

Licensed Users

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