X Display’s patented MTP (Micro-Transfer-Printing) technology integrates micron-scale semiconductor devices such as lasers, light-emitting devices (LEDs) or integrated circuits (ICs) onto non-native substrates. The X Display process uses an engineered elastomer print-head coupled to an automated printer to pick up and transfer arrays of very small and thin semiconductor-based devices. The MTP technology is ideal for heterogeneous integration of non-silicon devices and silicon integrated circuits in More-than-Moore applications, and for printing high-performance micron-scale device arrays onto plastic substrates in printed and flexible electronics applications.

Features:

• Camera: Firewire ½” format, 1384 x 1032 pixel
• Illumination: White LED
• FOV with 10x objective: 356 x 265 microns
• Chiplet (coupon) material: Silicon nitride
• Chiplet (coupon) dimensions: 40 x 40 x 1.2 microns
• Number printed in one cycle: 4 (2x2)
• Total number printed in 35 cycles: 140 chiplets (coupons)
• Target material: Silicon with metal marks and 1 micron print adhesive
• Qualified print yield: 99%
• Repeatability (precision): < 5 micron (3 sigma)