The HB10 series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding. An intuitive user interface provides the user with access to all of the bond parameters and bonding recepies stored on the machine. The HB10 series also benefits from a motorised Z axis giving more control over the looping of the wire.

Feaures:

• Motorised Z axis
• Intuitive Interface with Touch Screen Control
• Simple change between Ball and Wedge Bonding
• Deep and Wide Access Bondhead
• Automatic Bond Height Adjustment
• Electronic Wire Clamp for Precise Tail Length Control
• Parameters Entered using Real Units of Force and Time
• Motorised Wire Spool for Consistent Looping